AMD 7nm APU

This kills Intel on the high end laptop market.

Attached: ryzen-4800H.png (2048x2344, 93K)

bump.

can Intel even do chiplets?

>High end laptop manufacturers
>Putting an AMD sticker on their products
>Ever
You're completely delusional.
Normies think Incel is best, therefore manufacturers will use Incel and slap Incel stickers on their products

where the fuck is a 7nm IO?

They apparently have 2.5d that stacks vertically instead of horizontal like zenlets
Idk I think amds design is better from the yields alone
What is arm and nvidia doing?

???

normies only buy what their reviewers tell them to. Also, if Apple uses it in their new macbooks, they will sell millions of that thing.

Don't hype yourself up over something thats not going to happen. APUs aren't going to use chiplets, they're not going to feature HBM either. The primary market for these chips is 15w to 35w laptops. They're not going to ever release an APU with a substantial IGP and try to take a chunk out of the mid range discrete GPU market.
intel has major advantages in the mobile space that AMD doesn't have. intel has major partnerships with some panel manufacturers, and they can subsidize display costs for system builders if they use intel CPUs. They do the same thing with their own SSDs. AMD fit into the mobile space by being cheap. They have to do this because a company like ASUS can sell a $1300 intel powered thin laptop and have a better profit margin than if they build the same spec system with an AMD chip.

Zen2 APUs will be a small monolithic die. The IGP likely won't change much from the current 11CU design. They won't make a radical departure away from current packaging for mobile.

Lakefield.

OP is talking about Zen3 tho...

>AMD 7nm APU
No hes not.
The Ryzen mobile 3000 series is the 12nm refresh of Raven Ridge.
The first 7nm APU parts will be in the 4000 series naming scheme.

Coming soon™ in 2022 ... just wait™

What I found weird is that none has yet talked about heat development of the chip stacking tech. Isn't stacking chips on top of each other trapping heat/concentrating more heat in a smaller area?

look at OP's image. It says "Ryzen 4800H"

why would they want to sandwich their ovenlake chips on top of each other?

Attached: 1522910366401.jpg (400x400, 29K)

Yes, user.
Ryzen 3000 mobile parts are just a slight refresh of the first generation 14LPP parts with the code name Raven Ridge.
The first 7nm parts they release will be 4000 series, based on the same Zen2 core in upcoming Matisse.

4000 series APUs will not be Zen3.
Run off and be a fucking retard elsewhere.

Silicon has pretty great thermal conductance, and so far intel's ventures into 3D packaging extend only into stacking low power logic on top of another low power SoC, with a slice of DRAM on top of this. They're not doing it with high performance parts. Thats a very long way off.

Because bringing things together with lower wire length increases performance in almost every case.

Attached: intel-foveros-640x373.jpg (640x373, 38K)

Makes sense I guess. Smaller die areas for smaller formfactor devices like smartphones, tablets and wearables

Lol so Intel's ((high end)) housefires will be stuck on Monolithic low yield shit? Oy vey 10nm can't even save them now Inb4 they release a 7nm CPU out of nowhere with 6ghz+

Test

We're probably 18 months away from this given we're 6 months away from the 3xxx series desktop chips

that's nice bait. AMD announced some new 12nm laptop APUs at CES and some partnerships. They didn't announce any 7nm laptop-chips.

Intel's been convicted for some rather shady business practices in the past. It's fair to assume that they have contracts with most OEMs which state something along the lines of "you get a X% rebate if Y% of your units sold are Intel powered".

That's not what happens. Intel provides the popular high-end reference designs and helps OEM implement and advertise designs based on the reference designs. Ultrabooks and the flip convertibles that are so common now are both intel reference designs. AMD doesn't even create reference platforms like that, the last I recall was like for the jaguar APUs, some shitty GAYMING tablet.

are you retarded?

Apple has been using radeons for a while. Why nobody buys them?

I believe ARM alreadly does that with their SoCs for phones.

that's a lot of dead horses

for you.

>Why nobody buys them?
But macbooks are selling quite well...

Attached: dishonor.png (640x373, 220K)

ARM uses a method similar to AMD's

2021 actually. Unlike Intel, AMD keeps its timelines.

Not really necessary yet. It'll come someday but not for a while.

Then theres 5nm and 7nm euv

Half of the die would need to be GPU cores

It doesn't need HBM, there's already a ryzen apu that can use GDDR5 for the system memory.

Keep dreaming.

Reminder: The best APU chip ever made is STILL an Intel chip with 24CUs and 4GB HBM2, even after a year of AMD shilling retarded shit. And both the CPU and GPU are 14nm there.

Literally all they have to do is release a 24CU chip with 4GB HBM2 and half the "gaming laptop" market would switch to AMD. 7nm isn't real and 12nm is a meme.

Attached: KBL-G.png (678x383, 94K)

>2.5d that stacks vertically
bad cooling

You mean the semi-custom design AMD did for the Chinese console market.
AMD isn't wasting die area and power consumption on a GDDR5 memory PHY for the mainstream laptop market, nor are they going to cripple CPU performance by relying on this higher latency memory being tamed by a ring buffer. Especially not on bleeding edge 7nm silicon.

Friendly Reminder to install Slackware Linux
>As for the relationship between Slackware Linux and the Church of the SubGenius: Patrick "The Man" Volkerding is an ordained Church minister.

Attached: bob_dobbs_give_me_slack_.jpg (230x307, 21K)

CPU performance was fine with the GDDR5, the Chinese console thing manly just needed 12GBs of RAM

It would obviously be a more specialized product. but if it could manage most of an RX 570 in a smaller package than the i7 + 1060 laptops it would be pretty alright.

nah, that should be enough to fit a 24CU Vega 7nm.

>7nm isn't real
yes, it is.

Vega VII uses it, also Apple.

In current APUs half of the die is GPU cores

Attached: APU die.jpg (640x353, 49K)

That literally isn't an APU, its a discrete GPU in MCM package.

The next gen Ryzen mobile won't use Vega graphics, its Navi.

>7nm isn't real and 12nm is a meme.
What? TSMC's 7nm is only slightly behind Intel's 10nm. Considering the fact that Intel won't have 10nm working until 2020, they're fucked.

>TSMC's 7nm is only slightly behind Intel's 10nm
it's actually ahead of Intel's 10nm user...

Not in terms of transistor density.

That's probably Zen3 when yields are better, but given how GloFo is still 14nm, I don't know about that. When does the contract expire anyway?

Semantics.

>AMD's 7nm is worse than Intel's unfinished 10nm
Okay?

Damage control

>The best APU chip ever made is STILL an Intel chip with 24CUs and 4GB HBM2
>ignores the fact it's just an AMD GPU tied to inferior interconnect

What's the point of an APU retard? To get graphics in a smaller package. That's exactly what that chip does, and in the only way that has significantly mattered since the original AMD APUs.

You mean superior. It's much cheaper than conventional interposer packaging while maintaining the same performance.

It'll likely happen when costs have reduced in future

Alright then user. Let's ignore how fuckhuge that entire package is. You can't just slap that into any motherboard.

Yes you can? The fuck.

Attached: 8809g.png (1918x767, 1.22M)

At that point it might be better to use a discrete GPU, but the entire thing does look better for mobile solutions. Most of the cooling solutions are shared anyways.

you got everything backwards

This is an AMD GPU you fucking retard.

There is 15ff with 28 cus for chink console.

It is. Don't forget that they had to scale down their node to whatvwould be a 12nm in tgeir own terms.