So...NVIDIA and AMD are finished

youtu.be/-besHp8HLxo

wccftech.com/intel-lakefield-soc-revolutionary-forveros-3d-packaging-preview-sunny-cove-cpu-gen-11-gpu/

Attached: Intel-Lakefield-SOC-with-Foveros-3D-Packaging_7.png (2560x1440, 1.68M)

>Buying snake oil from Raja

Attached: ZgxAcnM.png (1359x1300, 964K)

"Do you think the AMD 10cm tall chip is impressive? we're going 15cm now!"

Attached: intel core i799900.jpg (3072x2304, 1.73M)

The only thing intel is good is muh ghz

Stackin this shit will produce alot of heat, intel making an oven

>(((intel))) making an oven
oy vey

Attached: 1544504526535.jpg (250x250, 9K)

Likes/dislikes and comments are disabled. Why so scared Intel?

CHIPLETS BTFO

????

It's stacks of chiplets though.

I'm actually looking forward to 3D stacking in CPUs.
It's the next logical step.
Even AMD is prepping 3d stacking for Zen 3.
You get low latancy combined with smaller high yield chips.
Rumors have sunny cove having a giant ass amount of L3 and L2 cache as well.

Jim Keller said 10nm sunny cove chips would not have any clock regression compared to 14nm.
So Intel obviously figured out how to keep it cool enough.
He wouldn't mention IPC, but said the chips we're able to more at the same time.
So maybe updated Hyper threading ex.

Not too knowledgeable on CPU design, but wouldn't this have to be very low power to not overheat?

>I'm actually looking forward to 3D stacking in CPUs.
>It's the next logical step.
This, and it solves a lot of issues.

>So Intel obviously figured out how to keep it cool enough.
maybe solder the chips to the IHS this time?

And lose out on .001 shekels!? No thank you.

>solder
Makes delidding harder. Not a fan of it personally.

>makes it harder to void my warranty for that 2c reduction
>I don't like it

>delliding is bad now
Jow Forums used to be filled with enthusiasts

>10nm
Release date: March 2030

It was always a way to fix Intel's stupid bullshit. What's good about needing to void your warranty just to have any thermal headroom on a K series chip?

>no comments or like ratio
But why tho, isn't this supposed to be the next step? Imagine having parts further separated and having huge stacks of extra memory, that would probably be the next big jump in CPU performance. When do you think AMD would go for stacking as well? Zen3 might be too early, but then I remember how much of a big deal Zen to Zen2 is.

call me when they actually have a DESKTOP cpu with this tech on it instead of a low powered mobile soc

JUST BUY IT SIR PLEASE BUY INTEL

If they struggle so hard to cool 2D chips, how are they gonna do it to a 3D stacked one?!?

I'm an enthusiast for not having to delid and lap my dies to get acceptable temperatures.

Honestly this is the biggest question. For everything else stacking chips is a great idea.

Forgotten the 1HP chiller already?

>muh fucking heat
wow dudes I'm so fucking smart I'm sure no one at intel has ever thought about that issue before!!

>Another attempt to get into mobile/ARM market after their Intel Atoms failed.
Nothing new here

>It was always a way to fix Intel's stupid bullshit
But I always delided my AMD CPUs as well. Only way to get decent sub ambient with them, and not to mention that my first delided was an AMD athlon (or maybe it was a socket 478 p4).
>I'm an enthusiast
Nah you weren't, and aren't. Otherwise you would have delided a CPU within the last 10 years.

>I'm sure no one at intel has ever thought about that issue before!!
wouldn't be the first time